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HOW
IT WORKS
Piezo
electricity | Patented technology
Piezo Electricity:
The piezo electric effect of natural crystals was discovered by the Curie brothers in 1880. At the time Rochelle salts and tourmaline were the best known
piezo electric materials. The ferro-electric ceramics, developed in the 30's for the production of electrical capacitors, also showed
piezo electric properties.
The concentrated research and material-development led to the present highly-effective
piezo electric
products, whose material parameters are widely variable and can therefore be optimally adapted to
any customer's requirements.
Direct Piezo Electric Effect:
If a force is applied to a piezo electric structure, surface charges are induced by the dielectric displacement, and therefore an electric field is built up.
Electrodes transforms this into electric voltage.
If the electrodes are shorted, the surface charges balance out by a current.
Indirect Piezo Electric Effect:
When an electric field acts on a piezo electric structure it becomes distorted. If this distortion is prevented, a T elastic tension occurs.
A force F is therefore applied to the device which prevents the distortion of the
piezo electric body.
This reversal of the direct piezo
electric effect is defined as indirect or inverse piezo effect.
In practice, the indirect piezo effect is used in static as well as dynamic operation.
Everswitch
- the patented technology:
The Baran VPM (Versatile Piezo Module):
The principle behind the Baran Piezo technology is the assembly of all the necessary components into a single unit (the Module) and thus eliminating the need for handling every single component for each Push Point manufactured.
The VPM is a solid state (no moving parts), stand alone module which may be arranged in any configuration by simply clicking it into the housing. The VPM also features a few significant advantages:
No soldering No adhesive
Unlike other common Piezo electric technologies, the VPM, is a mechanically assembled structure. It features a very stable structure unaffected by extreme temperature fluctuations and not prone to deterioration of components.
No adhesive is used in the assembly process and there is no need for soldering wires to the sensitive piezo ceramic.
Dependency on employee skills and workmanship is greatly reduced and the module, placed behind a 0.6mm thick membrane, is extremely durable and reliable.
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